L3 Narda-MITEQ Companies:

Mailing Address

L3 Narda-MITEQ
435 Moreland Road
Hauppauge, NY 11788
USA

PHONE: 631-231-1700
FAX: 631-231-1711

Send Special Product Requests, or any other questions or comments to:
componentsnm@l3t.com

Defense Technology Solutions

logo dts

Narda-MITEQ Defense Technology Solutions is positioned as an industry leader that offers advanced integrated microwave assembly (IMA) products and sub-systems to both the commercial and military markets. Every project we undertake benefits from our years of experience and world-class resources. Our strengths include:

  • Custom solutions incorporating leading edge technology from DC to 40 GHz
  • Advanced technology that produces cost savings, reductions in size and weight and improvement in efficiency and performance
  • Highly experienced, senior engineering staff, working at the forefront of integrated microwave assembly and sub-assembly development for over 30 years
  • Applications include electronic warfare, communications, radar, and Satcom
  • Designs which meet or exceed requirements for rugged military sea, air, and land platforms
  • Financial backing and resources of L3 Communications, a $15 billion-plus public corporation
  • An experienced, dedicated senior program management staff to minimize risk and ensure efficient, successful achievement of project requirements
  • 150,000 square-foot, state-of-the-art headquarters and design center, with two additional satellite locations

Narda-MITEQ has pioneered the design and manufacture of Integrated Microwave Assemblies (IMAs) for more than 30 years. The first IMAs manufactured by Narda-MITEQ, referred to as classic MICs, were realized by combining several alumina-on-carrier circuits within a single machined aluminum housing. These classic MIC multifunction assemblies provided high performance and longevity, yet the constraints of higher labor/materials costs and larger footprints were prohibitive. Today, while the vast majority of suppliers for IMA products are still using this conventional technology, the Narda Defense Technology Solution has evolved to effectively eliminate the constraints of chip and wire manufacture.Our new and continually evolving proprietary MMC (Multi-layer Microwave Circuitry) technology leverages commercially available multi-layer board materials with unique interconnection techniques, along with DSP/FPGA – enabled monitor/control functions, to allow for densely packaged IMA’s and Sub-Systems in footprints previously unachievable.

  • Narda-MITEQ’s MMC Technology

MMC uses multi-layered printed circuit boards to interconnect microwave devices (MIC, SMT, or MMIC configurations) with bias, control and digital signal processing components. These complex IMAs and Compact Sub-Systems are constructed using single or stacked multi-layer boards with the microwave circuitry on the top side, and the control circuitry, conditioning, microprocessor, FPGA and DSP circuits, on the bottom. Connections from top to bottom are made with specially developed via’s, as appropriate. Narda’s MMC technology allows the creation of more complex, high performance IMA modules with tightly controlled I/O locations and unusually small form factors that facilitate integration into complex next level assemblies.

The MMC technology utilized on our module and sub-system solutions consists of two major types of approaches, the Ultimate MIC and Ultimate SMT. The Ultimate MIC approach is utilized when the majority of the electrical components are bare die and chip, while Ultimate SMT technology is employed when there is a prevalence of surface mount devices. Each type of technology promotes the ability to combine traditional MIC chip and wire hybrid technology with high volume, low cost, surface mount assembly techniques. As a result our modules or compact sub-systems demonstrate unrivaled and previously unachievable integration levels. The results are smaller, reduced cost, higher performance solutions that combine microwave, bias/control circuits, and DSP functions interconnected with high isolation promoting multi-layer signal routing.

  • Facilities

Narda-MITEQ has three state-of-the-art facilities dedicated to IMA products; a 150,000 sq. ft. plant in Hauppauge, NY (design, development and production); another 20,000 sq. ft. plant in Heredia, Costa Rica (production); an 8,000 sq. ft. design center in San Diego (design and development). Narda maintains two Class 100,000 clean rooms.

  • Features of MMC enabled IMA modules and Sub-Systems:
  • A single multi-layer board construction integrates the RF/Microwave functions along with supporting bias, control, and DSP needs, facilitating an unmatched level of integration.
  • “Stacked” multi-layer board topology allows for growth in height while preserving footprint.
  • Allows for the marriage of traditional MIC technology with SMT as may be required.
  • Dense packaging , reduced weight and lowered power consumption for SWaP considerations
  • Custom solutions from DC to 40 GHz
  • Products
  • High Dynamic Range Front End Assemblies
  • Up and Down Converter Modules
  • Waveform Generators
  • LNA and SSPA
  • Transceivers
  • Pin Diode Switch Solutions
  • Switched Filter Banks
  • Frequency Sources

  • IMA Products Offered:

Narda-MITEQ produces three types of IMA products.

  • Simple IMA modules

Simple IMA modules integrate two or more microwave components into a functional assembly using conventional MIC technology.

  • Complex IMA Modules

Complex IMA Modules use MMC technology to create a much higher level of integration. These modules typically use the Ultimate MIC or Ultimate SMT topology.


Ka Band SSPA
Smart IMA using a microcontroller to provide maximum power output with minimum DC drive over temperature and system variations.


FPGA Programmable Source
This Ultimate MIC incorporates embedded FPGA configurable logic blocks to provide arbitrary waveform modulation of microwave signals.


Ku Band Block Upconverter
This IMA uses Ultimate SMT technology to provide a high performance, compact and efficient Ku band SATCOM block upconverter.

 


X Band DDS Synthesizer
Ultimate MIC X Band synthesizer provides stable signals with precision resolution


EW Antenna Interface
Complex IMA routing single input to multiple outputs with variable gain, preselection filtering and high power limiting in each path.


Switched Filter Bank
IMA utilizing high rejection PIN switches to select sharp cutoff channel filters

  • Compact Microwave Subsystems (CMS)

Compact Microwave Subsystems (CMS) use IMA modules and support devices to build complete functional subsystems


EW Receiver
Compact assembly of MMC (multilayer microwave circuitry) modules containing input and output switching networks, RF filters, and dual amplifier chains in a very small package.


RF Distribution Network
Complex distribution network integrating two multiplexers with input and output switching networks.


SATCOM Transceiver
Self contained transceiver for X, Ku or Ka band applications. High performance, low DC power and light weight.

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